PCF8574TS/F3,512
vs
MCP23008T-E/SSVAO
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
MICROCHIP TECHNOLOGY INC
Part Package Code
SSOP2
Package Description
LSSOP,
SSOP-20
Pin Count
20
Manufacturer Package Code
SOT266-1
Reach Compliance Code
unknown
compliant
Samacsys Manufacturer
NXP
Microchip
Clock Frequency-Max
0.1 MHz
10 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e4
e3
Length
6.5 mm
7.2 mm
Number of I/O Lines
8
8
Number of Ports
1
8
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
SSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Seated Height-Max
1.5 mm
2 mm
Supply Voltage-Max
6 V
5.5 V
Supply Voltage-Min
2.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
5.3 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.39.00.01
Number of Bits
8
Package Equivalence Code
SSOP20,.3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
AEC-Q100
Supply Current-Max
1 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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