PCA9561PW
vs
PCA9559PW,118
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
| Part Package Code |
TSSOP
|
|
| Package Description |
4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20
|
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
|
| HTS Code |
8542.32.00
|
|
| Additional Feature |
6-BIT 5-TO-1 MULTIPLEXER
|
|
| JESD-30 Code |
R-PDSO-G20
|
|
| JESD-609 Code |
e4
|
|
| Length |
6.5 mm
|
|
| Load Capacitance (CL) |
10 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
|
| Max I(ol) |
0.008 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
|
| Number of Inputs |
6
|
|
| Number of Outputs |
1
|
|
| Number of Terminals |
20
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP20,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
40 ns
|
|
| Propagation Delay (tpd) |
40 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
|
| Base Number Matches |
5
|
|
|
|
|
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