PCA9539APW,118
vs
PCA9555BSHP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
TSSOP2
QFN
Package Description
4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
HVQCCN,
Pin Count
24
24
Manufacturer Package Code
SOT355-1
SOT616-1
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
Factory Lead Time
16 Weeks
16 Weeks
Samacsys Manufacturer
NXP
NXP
Clock Frequency-Max
0.4 MHz
0.4 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G24
S-PQCC-N24
Length
7.8 mm
4 mm
Moisture Sensitivity Level
1
1
Number of Bits
16
Number of I/O Lines
16
16
Number of Ports
2
2
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
HVQCCN
Package Equivalence Code
TSSOP24,.25
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Seated Height-Max
1.1 mm
1 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
1.65 V
2.3 V
Supply Voltage-Nom
1.8 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4.4 mm
4 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
JESD-609 Code
e4
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Compare PCA9539APW,118 with alternatives
Compare PCA9555BSHP with alternatives