PCA8550DBRE4
vs
PCA8550PWDH
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
SSOP, SSOP16,.3
|
TSSOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
8550
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
6.2 mm
|
5 mm
|
| Load Capacitance (CL) |
15 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.006 A
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
4
|
4
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
TSSOP
|
| Package Equivalence Code |
SSOP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Prop. Delay@Nom-Sup |
20 ns
|
|
| Propagation Delay (tpd) |
20 ns
|
20 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.3 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
MINIMUM 10 YEARS DATA RETENTION
|
| JESD-609 Code |
|
e4
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare PCA8550DBRE4 with alternatives
Compare PCA8550PWDH with alternatives