PCA8550DBRE4 vs PCA8550DB-T feature comparison

PCA8550DBRE4 Texas Instruments

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PCA8550DB-T NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SSOP, SSOP16,.3 SSOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 8550
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 6.2 mm 6.2 mm
Load Capacitance (CL) 15 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.006 A
Number of Functions 1 1
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Packing Method TR
Prop. Delay@Nom-Sup 20 ns
Propagation Delay (tpd) 20 ns 20 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.3 mm
Base Number Matches 1 1
Rohs Code Yes
JESD-609 Code e4
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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