PCA8550DB,118
vs
PCA8550D-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SSOP1
SOIC
Package Description
PLASTIC, SOT-338-1, SSOP-16
SOP,
Pin Count
16
16
Manufacturer Package Code
SOT338-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.32.00
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e4
Length
6.2 mm
9.9 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
4
4
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE
Packing Method
TR, 13 INCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Propagation Delay (tpd)
20 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
3.9 mm
Base Number Matches
1
2
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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