PCA82C251TN3S430/N vs TH8050 feature comparison

PCA82C251TN3S430/N NXP Semiconductors

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TH8050 Melexis Microelectronic Integrated Systems

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS THESYS GESELLSCHAFT FUR MIKROELEKTRONIK MBH
Part Package Code SOIC
Package Description SOP, SOP,
Pin Count 8
Manufacturer Package Code SOT96-1
Reach Compliance Code unknown unknown
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
HTS Code 8542.39.00.01
Qualification Status Not Qualified

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