PCA6416APW,118
vs
MAX7311AUG-T
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
TSSOP2
|
|
| Package Description |
4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
|
TSSOP, TSSOP24,.25
|
| Pin Count |
24
|
|
| Manufacturer Package Code |
SOT355-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
16 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| Clock Frequency-Max |
0.4 MHz
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| Length |
7.8 mm
|
7.8 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
16
|
16
|
| Number of I/O Lines |
16
|
|
| Number of Ports |
2
|
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP24,.25
|
TSSOP24,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
1.65 V
|
|
| Supply Voltage-Nom |
1.8 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
4.4 mm
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
|
| Base Number Matches |
1
|
3
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare PCA6416APW,118 with alternatives