PC8641VSH1250GC
vs
MC8641DHX1333HB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
BGA,
BGA,
Pin Count
1023
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
166.66 MHz
166.66 MHz
External Data Bus Width
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B1023
S-CBGA-B1023
JESD-609 Code
e1
Length
33 mm
33 mm
Low Power Mode
YES
YES
Number of Terminals
1023
1023
Operating Temperature-Max
125 °C
105 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Seated Height-Max
2.77 mm
2.97 mm
Speed
1250 MHz
1333 MHz
Supply Voltage-Max
1.15 V
1.1 V
Supply Voltage-Min
1.05 V
1 V
Supply Voltage-Nom
1.1 V
1.05 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
33 mm
33 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
2
Qualification Status
Not Qualified
Compare PC8641VSH1250GC with alternatives
Compare MC8641DHX1333HB with alternatives