PC8641DVGH1500JC vs MC8640DTVU1250HE feature comparison

PC8641DVGH1500JC Teledyne e2v

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MC8640DTVU1250HE Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023
Pin Count 1023 1023
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166.66 MHz 166.66 MHz
External Data Bus Width 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B1023 S-CBGA-B1023
Length 33 mm 33 mm
Low Power Mode YES YES
Number of Terminals 1023 1023
Operating Temperature-Max 125 °C 105 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Seated Height-Max 2.97 mm 2.97 mm
Speed 1500 MHz 1250 MHz
Supply Voltage-Max 1.1 V 1.1 V
Supply Voltage-Min 1 V 1 V
Supply Voltage-Nom 1.05 V 1.05 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 33 mm 33 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 2
Pbfree Code No
Rohs Code Yes
JESD-609 Code e2
Moisture Sensitivity Level 3
Package Equivalence Code BGA1023,32X32,40
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
Terminal Finish Tin/Silver (Sn/Ag)
Time@Peak Reflow Temperature-Max (s) 30

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