PC8640VGH1250NE
vs
MC8640DVU1250HC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
FREESCALE SEMICONDUCTOR INC
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
166.66 MHz
|
166.66 MHz
|
| External Data Bus Width |
64
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Operating Temperature-Max |
125 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Code |
QCCJ
|
BGA
|
| Speed |
1250 MHz
|
1250 MHz
|
| Supply Voltage-Max |
1.1 V
|
1.1 V
|
| Supply Voltage-Min |
1 V
|
1 V
|
| Supply Voltage-Nom |
1.05 V
|
1.05 V
|
| Technology |
CMOS
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Package Description |
|
33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023
|
| Pin Count |
|
1023
|
| Integrated Cache |
|
YES
|
| JESD-30 Code |
|
S-CBGA-B1023
|
| JESD-609 Code |
|
e2
|
| Length |
|
33 mm
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Number of Terminals |
|
1023
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2.97 mm
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
TIN SILVER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
33 mm
|
|
|
|
Compare PC8640VGH1250NE with alternatives
Compare MC8640DVU1250HC with alternatives