PC8610MVT1066JB
vs
MPC8555ECVTAPFX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA,
|
BGA,
|
| Pin Count |
783
|
783
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
16
|
64
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| External Data Bus Width |
64
|
64
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B783
|
S-PBGA-B783
|
| JESD-609 Code |
e2
|
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
783
|
783
|
| Operating Temperature-Max |
125 °C
|
105 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
1066 MHz
|
833 MHz
|
| Supply Voltage-Max |
1.05 V
|
1.26 V
|
| Supply Voltage-Min |
0.95 V
|
1.14 V
|
| Supply Voltage-Nom |
1 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
2
|
| Clock Frequency-Max |
|
166 MHz
|
| Length |
|
29 mm
|
| Seated Height-Max |
|
3.75 mm
|
| Terminal Pitch |
|
1 mm
|
| Width |
|
29 mm
|
|
|
|
Compare PC8610MVT1066JB with alternatives
Compare MPC8555ECVTAPFX with alternatives