PC755CMGU300LE vs MPC755BRX300LE feature comparison

PC755CMGU300LE Teledyne e2v

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MPC755BRX300LE Freescale Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer E2V TECHNOLOGIES PLC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
Pin Count 360 360
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 100 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B360 S-CBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm 3.2 mm
Speed 300 MHz 300 MHz
Supply Voltage-Max 2.1 V 2.1 V
Supply Voltage-Min 1.8 V 1.8 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 5
Pbfree Code No
Rohs Code No
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
JESD-609 Code e0
Moisture Sensitivity Level 1
Package Equivalence Code BGA255,16X16,50
Peak Reflow Temperature (Cel) 220
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

Compare PC755CMGU300LE with alternatives

Compare MPC755BRX300LE with alternatives