PC755BVZFU350LE
vs
PCX755BMZFU350LE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
THOMSON-CSF COMPSANTS SPECIFIC
THOMSON-CSF SEMICONDUCTORS
Package Description
BGA, BGA360,19X19,50
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Category CO2 Kg
12.2
12.2
Bit Size
32
32
JESD-30 Code
S-PBGA-B360
S-PBGA-B360
JESD-609 Code
e0
Number of Terminals
360
360
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA360,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
350 MHz
350 MHz
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
4
3
Part Package Code
BGA
Pin Count
360
ECCN Code
3A991.A.2
Compliance Temperature Grade
Military: -55C to +125C
Address Bus Width
32
Boundary Scan
YES
Clock Frequency-Max
100 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
Low Power Mode
YES
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Supply Voltage-Max
2.1 V
Supply Voltage-Min
1.9 V
Supply Voltage-Nom
2 V
Temperature Grade
MILITARY
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