PC755BVZF350LE
vs
XPC755BRX350LB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
E2V TECHNOLOGIES PLC
MOTOROLA INC
Part Package Code
BGA
Package Description
BGA, BGA360,19X19,50
BGA,
Pin Count
360
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
100 MHz
100 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B360
S-CBGA-B360
Length
25 mm
25 mm
Low Power Mode
YES
YES
Number of Terminals
360
360
Operating Temperature-Max
110 °C
Operating Temperature-Min
40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Equivalence Code
BGA360,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.77 mm
3.2 mm
Speed
350 MHz
350 MHz
Supply Voltage-Max
2.1 V
2.1 V
Supply Voltage-Min
1.8 V
1.9 V
Supply Voltage-Nom
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Compare PC755BVZF350LE with alternatives
Compare XPC755BRX350LB with alternatives