PC755BVGU400LE
vs
MPC755CPX400LE
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
E2V TECHNOLOGIES PLC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360
|
Pin Count |
360
|
360
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
100 MHz
|
100 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B360
|
S-PBGA-B360
|
Length |
25 mm
|
25 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
360
|
360
|
Operating Temperature-Max |
110 °C
|
|
Operating Temperature-Min |
40 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
3.2 mm
|
2.77 mm
|
Speed |
400 MHz
|
400 MHz
|
Supply Voltage-Max |
2.1 V
|
2.1 V
|
Supply Voltage-Min |
1.8 V
|
1.9 V
|
Supply Voltage-Nom |
2 V
|
2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
25 mm
|
25 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
4
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Additional Feature |
|
ALSO REQUIRES 2.5V OR 3.3V SUPPLY
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
245
|
Terminal Finish |
|
TIN LEAD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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