PC755BMZFU300LD
vs
IBM25PPC750L-EB0B300W
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
IBM MICROELECTRONICS
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA, BGA360,19X19,50
|
BGA, BGA360,19X19,50
|
Pin Count |
360
|
360
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
100 MHz
|
100 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B360
|
S-CBGA-B360
|
JESD-609 Code |
e0
|
e0
|
Length |
25 mm
|
25 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
360
|
360
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA360,19X19,50
|
BGA360,19X19,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.77 mm
|
3.2 mm
|
Speed |
300 MHz
|
300 MHz
|
Supply Voltage-Max |
2.1 V
|
2.1 V
|
Supply Voltage-Min |
1.9 V
|
2 V
|
Supply Voltage-Nom |
2 V
|
2.05 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
25 mm
|
25 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
4
|
1
|
|
|
|
Compare PC755BMZFU300LD with alternatives
Compare IBM25PPC750L-EB0B300W with alternatives