PC755BMGU366LE
vs
MC7448VU867NC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ATMEL CORP
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
LGA
Package Description
BGA, BGA360,19X19,50
25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360
Pin Count
360
360
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
LOW POWER TAKEN FROM SLEEP MODE
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
NO
Clock Frequency-Max
100 MHz
867 MHz
External Data Bus Width
64
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
NO
JESD-30 Code
S-CBGA-B360
S-CBGA-B360
JESD-609 Code
e0
e1
Length
21 mm
25 mm
Low Power Mode
YES
YES
Number of Terminals
360
360
Operating Temperature-Max
125 °C
105 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Equivalence Code
BGA360,19X19,50
BGA360,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.2 mm
2.8 mm
Speed
366 MHz
867 MHz
Supply Voltage-Max
2.1 V
1.05 V
Supply Voltage-Min
1.8 V
0.95 V
Supply Voltage-Nom
2 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
21 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare PC755BMGU366LE with alternatives
Compare MC7448VU867NC with alternatives