PC7447VGU1000LB vs MC7447RX1000LB feature comparison

PC7447VGU1000LB Teledyne e2v

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MC7447RX1000LB Freescale Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
Pin Count 360 360
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 1.8V OR 2.5V SUPPLY
Address Bus Width 36 36
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 167 MHz 167 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B360 S-CBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 110 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm 3.2 mm
Speed 1000 MHz 1000 MHz
Supply Voltage-Max 1.35 V 1.35 V
Supply Voltage-Min 1.25 V 1.25 V
Supply Voltage-Nom 1.3 V 1.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 1
Package Equivalence Code BGA360,19X19,50
Peak Reflow Temperature (Cel) 220
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

Compare PC7447VGU1000LB with alternatives

Compare MC7447RX1000LB with alternatives