Findchips: Compare PC7447MGU700NB vs IBM25PPC750L-GB433A2T

PC7447MGU700NB vs IBM25PPC750L-GB433A2T feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	TELEDYNE E2V (UK) LTD	IBM MICROELECTRONICS
Part Package Code	BGA	BGA
Package Description	BGA,	25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
Pin Count	360	360
Reach Compliance Code	compliant	not_compliant
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Additional Feature	ALSO REQUIRES 1.8V OR 2.5V SUPPLY
Address Bus Width	36	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	167 MHz	100 MHz
External Data Bus Width	64	64
Format	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES
JESD-30 Code	S-CBGA-B360	S-CBGA-B360
Length	25 mm	25 mm
Low Power Mode	YES	YES
Number of Terminals	360	360
Operating Temperature-Max	125 °C	105 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.2 mm	3.2 mm
Speed	700 MHz	433 MHz
Supply Voltage-Max	1.15 V	2.2 V
Supply Voltage-Min	1.05 V	2 V
Supply Voltage-Nom	1.1 V	2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	2	1
Rohs Code		No
Package Equivalence Code		BGA360,19X19,50
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors