PC7447MGHU1000NC vs MPC755BPX350TD feature comparison

PC7447MGHU1000NC Teledyne e2v

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MPC755BPX350TD Motorola Mobility LLC

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD MOTOROLA INC
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 360 360
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 36 32
Bit Size 32 32
Boundary Scan YES NO
Clock Frequency-Max 167 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B360 S-PBGA-B360
Length 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 125 °C 105 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm
Speed 1000 MHz 350 MHz
Supply Voltage-Max 1.15 V
Supply Voltage-Min 1.05 V
Supply Voltage-Nom 1.1 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare PC7447MGHU1000NC with alternatives

Compare MPC755BPX350TD with alternatives