PC7410VGSU500LE
vs
MC7410VU500LE
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360
|
25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, HCTE, CERAMIC, BGA-360
|
| Pin Count |
360
|
360
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
133 MHz
|
133 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CBGA-B360
|
S-CBGA-B360
|
| Length |
25 mm
|
25 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
360
|
360
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
HBGA
|
| Package Equivalence Code |
CGA360,19X19,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, HEAT SINK/SLUG
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
4.2 mm
|
2.8 mm
|
| Speed |
500 MHz
|
500 MHz
|
| Supply Voltage-Max |
1.9 V
|
1.9 V
|
| Supply Voltage-Min |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
25 mm
|
25 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
3
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e2
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
TIN COPPER/TIN SILVER
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare PC7410VGSU500LE with alternatives