PC7410VGSU450NE vs TSXPC750AMGB/Q8LE feature comparison

PC7410VGSU450NE Teledyne e2v

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TSXPC750AMGB/Q8LE Atmel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC ATMEL CORP
Part Package Code BGA BGA
Package Description BGA, CGA360,19X19,50 BGA,
Pin Count 360 360
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 83.3 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B360 S-CBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Equivalence Code CGA360,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 3.2 mm
Speed 450 MHz 200 MHz
Supply Voltage-Max 1.55 V 2.7 V
Supply Voltage-Min 1.45 V 2.5 V
Supply Voltage-Nom 1.5 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code No
Moisture Sensitivity Level 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Screening Level MIL-STD-883 Class B
Temperature Grade MILITARY

Compare PC7410VGSU450NE with alternatives

Compare TSXPC750AMGB/Q8LE with alternatives