PC7410VG450LE
vs
PCX7447AMGHY1000NB
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
TELEDYNE E2V (UK) LTD
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA, BGA360,19X19,50
|
BGA,
|
Pin Count |
360
|
360
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
36
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
167 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B360
|
S-CBGA-B360
|
Length |
25 mm
|
25 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
360
|
360
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA360,19X19,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.2 mm
|
2.8 mm
|
Speed |
450 MHz
|
1000 MHz
|
Supply Voltage-Max |
1.9 V
|
1.15 V
|
Supply Voltage-Min |
1.7 V
|
1.05 V
|
Supply Voltage-Nom |
1.8 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
25 mm
|
25 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Temperature Grade |
|
MILITARY
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare PC7410VG450LE with alternatives
Compare PCX7447AMGHY1000NB with alternatives