PC7400VGSU350LX
vs
MPC8541ECPXAPEX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NXP SEMICONDUCTORS
Package Description
CI-CGA-360
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
100 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-CBGA-C360
Length
25 mm
Low Power Mode
YES
Number of Terminals
360
Operating Temperature-Max
110 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
CGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
4.2 mm
Speed
350 MHz
Supply Voltage-Max
1.9 V
Supply Voltage-Min
1.7 V
Supply Voltage-Nom
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
C BEND
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Base Number Matches
2
2
Compare PC7400VGSU350LX with alternatives
Compare MPC8541ECPXAPEX with alternatives