PC28F128P33B85B
vs
RC28F128P33B85A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICRON TECHNOLOGY INC
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
LEAD FREE, BGA-64
BGA-64
Pin Count
64
64
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
85 ns
85 ns
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block
BOTTOM
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
JESD-609 Code
e1
Length
10 mm
10 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
NOT SPECIFIED
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
Width
8 mm
8 mm
Base Number Matches
2
2
Moisture Sensitivity Level
NOT SPECIFIED
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
30
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