PBSS5330PA
vs
PBSS5560PA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
SON
Package Description
2 MM X 2 MM, 0.65 MM HEIGHT, LEADLESS, PLASTIC, HUSON-3
SMALL OUTLINE, R-PDSO-N3
Pin Count
3
3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
Case Connection
COLLECTOR
COLLECTOR
Collector Current-Max (IC)
3 A
5 A
Collector-Emitter Voltage-Max
30 V
60 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
100
90
JESD-30 Code
R-PDSO-N3
R-PDSO-N3
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
PNP
PNP
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Position
DUAL
DUAL
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
100 MHz
90 MHz
Turn-off Time-Max (toff)
200 ns
410 ns
Turn-on Time-Max (ton)
70 ns
88 ns
Base Number Matches
3
2
Samacsys Manufacturer
NXP
Compare PBSS5330PA with alternatives
Compare PBSS5560PA with alternatives