PBLS2003S,115
vs
PBLS2023D/T2
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEXPERIA
|
| Part Package Code |
SOIC
|
|
| Package Description |
PLASTIC, SOP-8
|
SMALL OUTLINE, R-PDSO-G6
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
SOT96-1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.21.00.95
|
|
| Factory Lead Time |
4 Weeks
|
|
| Additional Feature |
BUILT-IN BIAS RESISTOR RATIO IS 1
|
BUILT IN BIAS RESISTOR RATIO IS 1
|
| Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
| Collector-Emitter Voltage-Max |
50 V
|
50 V
|
| Configuration |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
|
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
|
| DC Current Gain-Min (hFE) |
30
|
30
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G6
|
| JESD-609 Code |
e4
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
2
|
2
|
| Number of Terminals |
8
|
6
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
NPN AND PNP
|
NPN AND PNP
|
| Power Dissipation-Max (Abs) |
1.5 W
|
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
100 MHz
|
|
| Turn-off Time-Max (toff) |
205 ns
|
|
| Turn-on Time-Max (ton) |
41 ns
|
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2017-02-01
|
|
|
|
Compare PBLS2003S,115 with alternatives
Compare PBLS2023D/T2 with alternatives