PALCE26V12H-10JC vs GAL26CV12B-10LJ feature comparison

PALCE26V12H-10JC Vantis Corporation

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GAL26CV12B-10LJ Lattice Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer VANTIS CORP LATTICE SEMICONDUCTOR CORP
Reach Compliance Code unknown not_compliant
Clock Frequency-Max 105 MHz 71.4 MHz
JESD-30 Code S-PQCC-J28 S-PQCC-J28
Number of Dedicated Inputs 14 13
Number of I/O Lines 12 12
Number of Terminals 28 28
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min
Organization 14 DEDICATED INPUTS, 12 I/O 13 DEDICATED INPUTS, 12 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Programmable Logic Type EE PLD EE PLD
Propagation Delay 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Form J BEND J BEND
Terminal Position QUAD QUAD
Base Number Matches 1 1
Rohs Code No
Part Package Code QLCC
Package Description PLASTIC, LCC-28
Pin Count 28
ECCN Code EAR99
HTS Code 8542.39.00.01
Additional Feature REGISTER PRELOAD; POWER-UP RESET
Architecture PAL-TYPE
JESD-609 Code e0
Length 11.5062 mm
Moisture Sensitivity Level 1
Number of Inputs 26
Number of Outputs 12
Number of Product Terms 122
Package Code QCCJ
Package Equivalence Code LDCC28,.5SQ
Peak Reflow Temperature (Cel) 225
Seated Height-Max 4.572 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 11.5062 mm

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Compare GAL26CV12B-10LJ with alternatives