PALCE22V10H-25PI vs PALCE22V10Z-25PI feature comparison

PALCE22V10H-25PI AMD

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PALCE22V10Z-25PI Vantis Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC VANTIS CORP
Part Package Code DIP
Package Description DIP, DIP24,.3 0.300 INCH, SKINNY, PLASTIC, DIP-24
Pin Count 24
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature 10 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; ASYNCHRONOUS RESET; SYNCHRONOUS PRESET
Architecture PAL-TYPE PAL-TYPE
Clock Frequency-Max 33.3 MHz 33.3 MHz
JESD-30 Code R-PDIP-T24 R-PDIP-T24
JESD-609 Code e0 e0
Length 30.734 mm
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Inputs 22 22
Number of Outputs 10 10
Number of Product Terms 132 132
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type EE PLD EE PLD
Propagation Delay 25 ns 25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 3

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