PAL20R4ANC
vs
GAL20RA10-20JC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP, DIP24,.3
DIP, DIP24,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
PAL-TYPE
Clock Frequency-Max
28.5 MHz
33 MHz
JESD-30 Code
R-PDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
31.915 mm
Number of Dedicated Inputs
12
10
Number of I/O Lines
4
10
Number of Inputs
16
20
Number of Outputs
8
10
Number of Product Terms
64
80
Number of Terminals
24
24
Operating Temperature-Max
75 °C
75 °C
Operating Temperature-Min
Organization
12 DEDICATED INPUTS, 4 I/O
10 DEDICATED INPUTS, 10 I/O
Output Function
MIXED
MACROCELL
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
OT PLD
EE PLD
Propagation Delay
25 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.715 mm
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
DIP
Pin Count
24
Compare PAL20R4ANC with alternatives
Compare GAL20RA10-20JC with alternatives