PAL16R8ANC
vs
PAL16R8ACJ
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MONOLITHIC MEMORIES
Part Package Code
DIP
Package Description
DIP, DIP20,.3
DIP-20
Pin Count
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Architecture
PAL-TYPE
PAL-TYPE
Clock Frequency-Max
25 MHz
25 MHz
JESD-30 Code
R-PDIP-T20
R-XDIP-T20
JESD-609 Code
e0
e0
Length
26.075 mm
Number of Dedicated Inputs
8
Number of I/O Lines
Number of Inputs
8
8
Number of Outputs
8
8
Number of Product Terms
64
64
Number of Terminals
20
20
Operating Temperature-Max
75 °C
70 °C
Operating Temperature-Min
Organization
8 DEDICATED INPUTS, 0 I/O
Output Function
REGISTERED
REGISTERED
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
OT PLD
OT PLD
Propagation Delay
20 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
3
5
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