PAL16L8D/2PC vs PLUS16L8DN feature comparison

PAL16L8D/2PC AMD

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PLUS16L8DN Philips Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description PLASTIC, DIP-20 DIP-20
Pin Count 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature PAL
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e0 e0
Length 26.035 mm
Number of Dedicated Inputs 10
Number of I/O Lines 6
Number of Inputs 16 16
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 20 20
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min
Organization 10 DEDICATED INPUTS, 6 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 2 3

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