PAL16L8B-4MW/883B
vs
TIBPAL16L8-30MWB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DFP
|
DFP
|
| Package Description |
DFP, FL20,.3
|
DFP, FL20,.3
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
PAL
|
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| JESD-30 Code |
R-CDFP-F20
|
R-GDFP-F20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
12.954 mm
|
13.09 mm
|
| Number of Dedicated Inputs |
10
|
10
|
| Number of I/O Lines |
6
|
6
|
| Number of Inputs |
16
|
16
|
| Number of Outputs |
8
|
8
|
| Number of Product Terms |
64
|
64
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
10 DEDICATED INPUTS, 6 I/O
|
10 DEDICATED INPUTS, 6 I/O
|
| Output Function |
COMBINATORIAL
|
COMBINATORIAL
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL20,.3
|
FL20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Programmable Logic Type |
OT PLD
|
OT PLD
|
| Propagation Delay |
50 ns
|
30 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
MIL-STD-883
|
| Seated Height-Max |
2.286 mm
|
2.54 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
9.779 mm
|
6.92 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Clock Frequency-Max |
|
30 MHz
|
| In-System Programmable |
|
NO
|
| JTAG BST |
|
NO
|
| Packing Method |
|
TUBE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare PAL16L8B-4MW/883B with alternatives
Compare TIBPAL16L8-30MWB with alternatives