PAL16L8B-4CN
vs
PAL16R6-10LMB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MONOLITHIC MEMORIES
CYPRESS SEMICONDUCTOR CORP
Package Description
DIP-20
QCCN, LCC20,.35SQ
Reach Compliance Code
unknown
not_compliant
Architecture
PAL-TYPE
PAL-TYPE
JESD-30 Code
R-PDIP-T20
S-CQCC-N20
JESD-609 Code
e0
e0
Number of Inputs
16
10
Number of Outputs
8
6
Number of Product Terms
64
64
Number of Terminals
20
20
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Function
COMBINATORIAL
MIXED
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Equivalence Code
DIP20,.3
LCC20,.35SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Programmable Logic Type
OT PLD
OT PLD
Propagation Delay
35 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
BICMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Base Number Matches
3
1
Part Package Code
QLCC
Pin Count
20
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
Additional Feature
POWER-UP RESET
Clock Frequency-Max
87 MHz
Length
8.89 mm
Number of Dedicated Inputs
8
Number of I/O Lines
2
Organization
8 DEDICATED INPUTS, 2 I/O
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
1.905 mm
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Width
8.89 mm
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