PAL16L8B-4CN
vs
AMPAL20R6BPC
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MONOLITHIC MEMORIES
ADVANCED MICRO DEVICES INC
Package Description
DIP-20
DIP, DIP24,.3
Reach Compliance Code
unknown
unknown
Architecture
PAL-TYPE
PAL-TYPE
JESD-30 Code
R-PDIP-T20
R-PDIP-T24
JESD-609 Code
e0
e0
Number of Inputs
16
14
Number of Outputs
8
8
Number of Product Terms
64
64
Number of Terminals
20
24
Operating Temperature-Max
70 °C
75 °C
Operating Temperature-Min
Output Function
COMBINATORIAL
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
OT PLD
OT PLD
Propagation Delay
35 ns
18 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL EXTENDED
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Part Package Code
DIP
Pin Count
24
HTS Code
8542.39.00.01
Clock Frequency-Max
37 MHz
Number of Dedicated Inputs
12
Number of I/O Lines
2
Organization
12 DEDICATED INPUTS, 2 I/O
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
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