PAL16L8B-4CN vs AMPAL20R6BPC feature comparison

PAL16L8B-4CN Monolithic Memories Inc (MMI)

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AMPAL20R6BPC AMD

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MONOLITHIC MEMORIES ADVANCED MICRO DEVICES INC
Package Description DIP-20 DIP, DIP24,.3
Reach Compliance Code unknown unknown
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-PDIP-T20 R-PDIP-T24
JESD-609 Code e0 e0
Number of Inputs 16 14
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 20 24
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min
Output Function COMBINATORIAL MIXED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 35 ns 18 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Part Package Code DIP
Pin Count 24
HTS Code 8542.39.00.01
Clock Frequency-Max 37 MHz
Number of Dedicated Inputs 12
Number of I/O Lines 2
Organization 12 DEDICATED INPUTS, 2 I/O
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V

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