PAL16L8ANC vs PAL16L8ACN feature comparison

PAL16L8ANC National Semiconductor Corporation

Buy Now Datasheet

PAL16L8ACN Vantis Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP VANTIS CORP
Package Description DIP, DIP20,.3 DIP-20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ACTIVE LOW OUTPUT
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e0 e0
Length 26.075 mm
Number of Dedicated Inputs 10
Number of I/O Lines 6
Number of Inputs 16 16
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 20 20
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min
Organization 10 DEDICATED INPUTS, 6 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 25 ns 25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 6

Compare PAL16L8ANC with alternatives