PAL16L8-10LMB
vs
AMPAL16L8BLE
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
QLCC
|
QLCC
|
Package Description |
QCCN, LCC20,.35SQ
|
QCCN, LCC20,.35SQ
|
Pin Count |
20
|
20
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
PAL
|
|
Architecture |
PAL-TYPE
|
PAL-TYPE
|
JESD-30 Code |
S-CQCC-N20
|
S-CQCC-N20
|
JESD-609 Code |
e0
|
e0
|
Length |
8.89 mm
|
8.89 mm
|
Number of Dedicated Inputs |
10
|
10
|
Number of I/O Lines |
6
|
6
|
Number of Inputs |
16
|
16
|
Number of Outputs |
8
|
8
|
Number of Product Terms |
64
|
64
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
10 DEDICATED INPUTS, 6 I/O
|
10 DEDICATED INPUTS, 6 I/O
|
Output Function |
COMBINATORIAL
|
COMBINATORIAL
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCN
|
QCCN
|
Package Equivalence Code |
LCC20,.35SQ
|
LCC20,.35SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Programmable Logic Type |
OT PLD
|
OT PLD
|
Propagation Delay |
10 ns
|
15 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Seated Height-Max |
1.905 mm
|
2.54 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
TTL
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
8.89 mm
|
8.89 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare PAL16L8-10LMB with alternatives
Compare AMPAL16L8BLE with alternatives