PAL16L8-10LMB
vs
AMPAL16L8LMB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
QLCC
QFN
Package Description
QCCN, LCC20,.35SQ
QCCN, LCC20,.35SQ
Pin Count
20
20
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
PAL
Architecture
PAL-TYPE
PAL-TYPE
JESD-30 Code
S-CQCC-N20
S-CQCC-N20
JESD-609 Code
e0
e0
Length
8.89 mm
8.89 mm
Number of Dedicated Inputs
10
10
Number of I/O Lines
6
6
Number of Inputs
16
16
Number of Outputs
8
8
Number of Product Terms
64
64
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
10 DEDICATED INPUTS, 6 I/O
10 DEDICATED INPUTS, 6 I/O
Output Function
COMBINATORIAL
COMBINATORIAL
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Equivalence Code
LCC20,.35SQ
LCC20,.35SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Programmable Logic Type
OT PLD
OT PLD
Propagation Delay
10 ns
40 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
MIL-STD-883 Class B (Modified)
Seated Height-Max
1.905 mm
2.54 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
BICMOS
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
8.89 mm
8.89 mm
Base Number Matches
1
1
Compare PAL16L8-10LMB with alternatives
Compare AMPAL16L8LMB with alternatives