PAL16L8-10DMB
vs
PLUS16L8/BRA
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP20,.3
|
|
Pin Count |
20
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
PAL
|
|
Architecture |
PAL-TYPE
|
|
JESD-30 Code |
R-GDIP-T20
|
|
JESD-609 Code |
e0
|
|
Length |
24.13 mm
|
|
Number of Dedicated Inputs |
10
|
|
Number of I/O Lines |
6
|
|
Number of Inputs |
16
|
|
Number of Outputs |
8
|
|
Number of Product Terms |
64
|
|
Number of Terminals |
20
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
10 DEDICATED INPUTS, 6 I/O
|
|
Output Function |
COMBINATORIAL
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP20,.3
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Programmable Logic Type |
OT PLD
|
OT PLD
|
Propagation Delay |
10 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Seated Height-Max |
5.08 mm
|
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
4.5 V
|
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
NO
|
|
Technology |
BICMOS
|
|
Temperature Grade |
MILITARY
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
2
|
|
|
|
Compare PAL16L8-10DMB with alternatives
Compare PLUS16L8/BRA with alternatives