PAL12L10CJS vs PAL12L10ANC feature comparison

PAL12L10CJS AMD

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PAL12L10ANC National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP24,.3 DIP, DIP24,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-XDIP-T24 R-PDIP-T24
JESD-609 Code e0 e0
Number of Inputs 12 12
Number of Outputs 10 10
Number of Product Terms 20 20
Number of Terminals 24 24
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 3
Additional Feature ACTIVE LOW OUTPUT
Length 31.915 mm
Number of Dedicated Inputs 12
Number of I/O Lines
Organization 12 DEDICATED INPUTS, 0 I/O
Propagation Delay 25 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Width 7.62 mm

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