PAL10H8CJ vs PAL10H8NC feature comparison

PAL10H8CJ AMD

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PAL10H8NC National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NATIONAL SEMICONDUCTOR CORP
Package Description DIP-20 PLASTIC, DIP-20
Reach Compliance Code unknown unknown
Factory Lead Time 4 Weeks
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-XDIP-T20 R-PDIP-T20
JESD-609 Code e0 e0
Number of Inputs 10 10
Number of Outputs 8 8
Number of Product Terms 16 16
Number of Terminals 20 20
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type EE PLD OT PLD
Propagation Delay 35 ns 35 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 4
HTS Code 8542.39.00.01
Additional Feature ACTIVE HIGH OUTPUT
Length 26.075 mm
Number of Dedicated Inputs 10
Number of I/O Lines
Organization 10 DEDICATED INPUTS, 0 I/O
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Width 7.62 mm

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