PAL10H8AJC vs 8103501RX feature comparison

PAL10H8AJC National Semiconductor Corporation

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8103501RX Texas Instruments

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP20,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ACTIVE HIGH OUTPUT
Architecture PAL-TYPE
JESD-30 Code R-GDIP-T20 R-PDIP-T20
JESD-609 Code e0
Length 24.51 mm 25.908 mm
Number of Dedicated Inputs 10 10
Number of I/O Lines
Number of Inputs 10
Number of Outputs 8
Number of Product Terms 16
Number of Terminals 20 20
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 10 DEDICATED INPUTS, 0 I/O 10 DEDICATED INPUTS, 0 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 25 ns 45 ns
Qualification Status Not Qualified
Seated Height-Max 5.08 mm 4.318 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
ECCN Code 3A001.A.2.C

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