PAL10H8A2JM vs 8103501RA feature comparison

PAL10H8A2JM National Semiconductor Corporation

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8103501RA Monolithic Memories (RETIRED)

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP MONOLITHIC MEMORIES
Package Description DIP, DIP20,.3 0.250 X 1 INCH, PLASTIC, DIP-20
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
Additional Feature ACTIVE HIGH OUTPUT
Architecture PAL-TYPE
JESD-30 Code R-GDIP-T20 R-PDIP-T20
JESD-609 Code e0
Length 24.51 mm 25.908 mm
Number of Dedicated Inputs 10 10
Number of I/O Lines
Number of Inputs 10
Number of Outputs 8
Number of Product Terms 16
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 10 DEDICATED INPUTS, 0 I/O 10 DEDICATED INPUTS, 0 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 45 ns 45 ns
Qualification Status Not Qualified
Seated Height-Max 5.08 mm 4.318 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 3

Compare PAL10H8A2JM with alternatives

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