PACE1757ME-20PGMB
vs
MC68000CRC12
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
PGA
Pin Count
68
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
Address Bus Width
16
Bit Size
16
32
Boundary Scan
NO
Clock Frequency-Max
20 MHz
External Data Bus Width
16
Format
FLOATING POINT
Integrated Cache
NO
JESD-30 Code
S-CPGA-P68
S-XPGA-P68
Length
28.5623 mm
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
8
Number of Serial I/Os
Number of Terminals
68
68
On Chip Data RAM Width
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
4.572 mm
Speed
20 MHz
12.5 MHz
Supply Current-Max
280 mA
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
MOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
28.5623 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
3
Rohs Code
Package Description
PGA, PGA68,10X10
JESD-609 Code
e0
Package Equivalence Code
PGA68,10X10
Power Supplies
5 V
Terminal Finish
Tin/Lead (Sn/Pb)
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