PACE1757M-30QLC
vs
MB86833PFV-G
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
| Part Package Code |
QFP
|
|
| Package Description |
QFP-144
|
LFQFP,
|
| Pin Count |
144
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
40
|
28
|
| Bit Size |
16
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
30 MHz
|
33.33 MHz
|
| External Data Bus Width |
16
|
32
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-XQFP-F144
|
S-PQFP-G144
|
| Length |
29.21 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
QFF
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.556 mm
|
1.7 mm
|
| Speed |
30 MHz
|
|
| Supply Voltage-Max |
5.5 V
|
3.6 V
|
| Supply Voltage-Min |
4.5 V
|
3 V
|
| Supply Voltage-Nom |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
0.6 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
29.21 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare PACE1757M-30QLC with alternatives
Compare MB86833PFV-G with alternatives