PA90
vs
MSK130
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
APEX MICROTECHNOLOGY INC
|
ANAREN INC
|
Part Package Code |
SFM
|
|
Package Description |
, SIP12,.16TB
|
,
|
Pin Count |
12
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Average Bias Current-Max (IIB) |
0.002 µA
|
0.0002 µA
|
Bias Current-Max (IIB) @25C |
0.002 µA
|
|
Common-mode Reject Ratio-Nom |
98 dB
|
90 dB
|
Frequency Compensation |
YES (AVCL>=30)
|
|
Input Offset Voltage-Max |
2000 µV
|
2000 µV
|
JESD-30 Code |
R-PSFM-T12
|
R-CSFM-T10
|
Low-Bias |
NO
|
|
Low-Offset |
NO
|
|
Micropower |
NO
|
|
Neg Supply Voltage Limit-Max |
-200 V
|
-200 V
|
Neg Supply Voltage-Nom (Vsup) |
-150 V
|
-100 V
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
10
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-25 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Equivalence Code |
SIP12,.16TB
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Power |
YES
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Slew Rate-Min |
240 V/us
|
|
Slew Rate-Nom |
300 V/us
|
300 V/us
|
Supply Current-Max |
14 mA
|
|
Supply Voltage Limit-Max |
200 V
|
200 V
|
Supply Voltage-Nom (Vsup) |
150 V
|
100 V
|
Surface Mount |
NO
|
NO
|
Technology |
MOS
|
BICMOS
|
Temperature Grade |
OTHER
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
SINGLE
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Unity Gain BW-Nom |
100000
|
|
Voltage Gain-Min |
50100
|
|
Wideband |
YES
|
|
Base Number Matches |
3
|
1
|
|
|
|