PA28F400BX-80
vs
AT27C4096-12TI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
Package Description
0.525 X 1.110 INCH, PLASTIC, SOP-44
PLASTIC, TSOP-40
Pin Count
44
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
Access Time-Max
80 ns
45 ns
Alternate Memory Width
8
Boot Block
BOTTOM/TOP
JESD-30 Code
R-PDSO-G44
R-PDSO-G40
Length
28.2 mm
18.4 mm
Memory Density
4194304 bit
524288 bit
Memory IC Type
FLASH
OTP ROM
Memory Width
16
8
Number of Functions
1
1
Number of Terminals
44
40
Number of Words
262144 words
262144 words
Number of Words Code
256000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256K16
64KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.62 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
MOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
Width
13.3 mm
10 mm
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e0
Supply Current-Max
0.04 mA
Terminal Finish
TIN LEAD
Compare PA28F400BX-80 with alternatives
Compare AT27C4096-12TI with alternatives