P89V660FBC,557
vs
SST89E54RD2-40-C-TQJE
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
STMICROELECTRONICS
|
| Part Package Code |
QFP
|
|
| Package Description |
10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, SOT376-1, TQFP-44
|
|
| Pin Count |
44
|
|
| Manufacturer Package Code |
SOT376-1
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
|
| Address Bus Width |
16
|
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
8051
|
| Clock Frequency-Max |
40 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQFP-G44
|
| Length |
10 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
36
|
|
| Number of Terminals |
44
|
44
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TQFP
|
QFP
|
| Package Equivalence Code |
TQFP44,.47SQ,32
|
TQFP44,.47SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
512
|
1024
|
| ROM (words) |
16384
|
16384
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.2 mm
|
|
| Speed |
40 MHz
|
40 MHz
|
| Supply Current-Max |
50 mA
|
88 mA
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
5 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
|
| Base Number Matches |
1
|
2
|
|
|
|
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