P89V51RB2BBC,557 vs P89C660HFA/00,512 feature comparison

P89V51RB2BBC,557 NXP Semiconductors

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P89C660HFA/00,512 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFP LPCC
Package Description 10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-44 QCCJ, LDCC44,.7SQ
Pin Count 44 44
Manufacturer Package Code SOT376-1
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 40 MHz 33 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G44 S-PQCC-J44
Length 10 mm 16.5862 mm
Moisture Sensitivity Level 3
Number of I/O Lines 32 32
Number of Terminals 44 44
On Chip Program ROM Width 8 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TQFP QCCJ
Package Equivalence Code TQFP44,.47SQ,32 LDCC44,.7SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE CHIP CARRIER
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
RAM (bytes) 1024 512
ROM (words) 16384 16384
ROM Programmability FLASH FLASH
Seated Height-Max 1.2 mm 4.57 mm
Speed 40 MHz 33 MHz
Supply Current-Max 50 mA 64 mA
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING J BEND
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 10 mm 16.5862 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Rohs Code Yes

Compare P89V51RB2BBC,557 with alternatives

Compare P89C660HFA/00,512 with alternatives